TAIPEI, Taiwan, June 3 /PRNewswire-FirstCall/ -- Computex 2008 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced its next generation Bluetooth(R) Version 2.1 + EDR single-chip solution that provides significant performance upgrades and enhanced features, including lower power consumption, smaller chip size and improved radio performance. Developed in a highly advanced 65 nanometer CMOS process, the new system-on-chip (SoC) solution targets mobile handset applications and includes the unique Broadcom(R) SmartAudio(TM) sound and voice enhancement technology that was previously available only in wireless headset products. Cellular handset makers can now offer improvements in battery life and audio quality, providing a clearer, more satisfying wireless experience to consumers.

Bluetooth has continued to grow in popularity in the mobile handset segment as an enabler of hands-free functionality and as a convenient way to wirelessly enjoy digital multimedia such as stereo music. As handheld devices continue to add additional technologies such as multimedia processing, Wi-Fi(R), GPS and others, Bluetooth solutions that are smaller in size and provide less of a strain on system battery life are gaining increasing traction amongst OEMs. Broadcom's new silicon and software Bluetooth solution uniquely addresses these key requirements.

"Broadcom has achieved leadership as a supplier of Bluetooth technology in the mobile phone market by consistently delivering the innovations that handset makers desire for their products," said Craig Ochikubo, Senior Director of Marketing for Broadcom's Personal Area Networking line of business. "Enabling improved audio performance in handsets with a smaller, lower power solution provides our customers yet another advantage for their advanced handset devices."

Announced today is Broadcom's new single-chip BCM2070 that integrates a high performance 2.4 GHz "Class 1" Bluetooth radio for improved output power, providing a stronger radio connection between handsets and other devices such as headphones or wireless headsets, and a more satisfying end user experience. Based on 65 nanometer CMOS technology and enabling Bluetooth version 2.1 + EDR (the most advanced version of the technology), the BCM2070 introduces new levels of performance for Bluetooth devices including the smallest available solution (with an innovative chip-on-board implementation enabling board space designs of less than 25mm2) and a savings in power consumption of up to 40% compared to other Bluetooth solutions.

The BCM2070 is based on multiple generations of Broadcom's field proven Bluetooth technology and features a new RF architecture that provides key improvements in receive sensitivity and transmit output power to ensure better connectivity between mobile phone and headset products. The new chip also allows the handset to stream stereo music to multiple users simultaneously using the advanced A2DP Bluetooth profile - a feature made increasingly attractive as handsets add advanced multimedia capabilities and move to the center of the personal area network.

Additionally, the BCM2070 integrates key elements of the company's SmartAudio sound and voice enhancement technology that significantly improves the audio quality of Bluetooth links. The audio enhancement technologies in the BCM2070 include Broadcom's unique packet loss concealment (PLC) technology that reshapes audio streams, compensating for lost data packets and delivering clearer digital voice communications. SmartAudio PLC is based on the company's extensive experience and research in processing voice in voice over IP (VoIP) applications.

Broadcom PLC technology has been specially developed to improve audio quality in wireless systems, which are particularly susceptible to packet loss and connection issues with radio interference occurring from other radio frequency (RF) signals, as well as blocking from buildings, structures or even human bodies. As governments and municipalities enact legislation requiring "hands-free" configurations for in-car mobile phone use, the ability to deliver compelling voice conversations over Bluetooth grows increasingly important.

Green by Design

Broadcom and its foundry partners are leveraging today's most advanced lithographic node for manufacturing semiconductors. By designing solutions in 65 nm process technology, Broadcom is able to provide significant environmental benefits over competitive solutions in 90 nm and 130 nm processes by enabling lower power consumption, smaller size and higher yields while providing higher levels of integration that result in fewer components. Additionally, Broadcom supports the current industry initiatives to remove lead (Pb) and other hazardous materials, such as halogens like bromide and chlorine, from all products. With the depth and breadth of Broadcom's advanced portfolio of market-proven IP, the company is able to drive innovative new products to market while reducing the impact on human health and the environment.

Availability and Pricing

The single-chip BCM2070 Bluetooth baseband processor is sampling to early access customers. Pricing is available upon request.

About Broadcom

Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything(R).

Broadcom is one of the world's largest fabless semiconductor companies, with 2007 revenue of $3.78 billion, and holds over 2,600 U.S. and 1,200 foreign patents, more than 7,450 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.

Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at http://www.broadcom.com.

Cautions regarding Forward Looking Statements:

All statements included or incorporated by reference in this release, other than statements or characterizations of historical fact, are forward- looking statements. These forward-looking statements are based on our current expectations, estimates and projections about our industry and business, management's beliefs, and certain assumptions made by us, all of which are subject to change. Forward-looking statements can often be identified by words such as "anticipates," "expects," "intends," "plans," "predicts," "believes," "seeks," "estimates," "may," "will," "should," "would," "could," "potential," "continue," "ongoing," similar expressions, and variations or negatives of these words. These forward-looking statements are not guarantees of future results and are subject to risks, uncertainties and assumptions that could cause our actual results to differ materially and adversely from those expressed in any forward-looking statement.

Important factors that may cause such a difference for Broadcom in connection with BCM2070 Bluetooth baseband processor products include, but are not limited to

-- Trends in the wireless networking markets in various geographic regions, including seasonality in sales of consumer products into which our products are incorporated, and possible disruption in commercial activities related to terrorist activity or armed conflict in the United States and other locations; -- The rate at which our present and future customers and end-users adopt Broadcom's technologies and products in the markets for Bluetooth applications; -- Changes in our product or customer mix; -- The volume of our product sales and pricing concessions on volume sales; -- Our ability to timely and accurately predict market requirements and evolving industry standards and to identify opportunities in new markets; -- Competitive pressures and other factors such as the qualification, availability and pricing of competing products and technologies and the resulting effects on sales and pricing of our products.

Additional factors that may cause Broadcom's actual results to differ materially from those expressed in forward-looking statements include, but are not limited to:

-- delays in the adoption and acceptance of industry standards in the markets for Bluetooth applications; -- the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; -- the gain or loss of a key customer, design win or order; -- our ability to scale our operations in response to changes in demand for our existing products and services or demand for new products requested by our customers; -- intellectual property disputes and customer indemnification claims and other types of litigation risk; -- our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans the quality of our products and any remediation costs; -- our ability to specify, develop or acquire, complete, introduce, market and transition to volume production new products and technologies in a cost-effective and timely manner; -- the effectiveness of our expense and product cost control and reduction efforts; -- problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; -- the risks and uncertainties associated with our international operations; -- the timing of customer-industry qualification and certification of our products and the risks of non-qualification or non-certification; -- the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; -- fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; -- the risks of producing products with new suppliers and at new fabrication and assembly facilities; -- the effects of natural disasters, public health emergencies, international conflicts and other events beyond our control; and -- the level of orders received that can be shipped in a fiscal quarter.

Our Annual Report on Form 10-K, subsequent Quarterly Reports on Form 10-Q, recent Current Reports on Form 8-K, and other Securities and Exchange Commission filings discuss the foregoing risks as well as other important risk factors that could contribute to such differences or otherwise affect our business, results of operations and financial condition. The forward-looking statements in this release speak only as of this date. We undertake no obligation to revise or update publicly any forward-looking statement, except as required by law.

Broadcom(R), the pulse logo, Connecting everything(R), the Connecting everything logo and SmartAudio(TM) are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Bluetooth(R) is a trademark of Bluetooth SIG, Inc. Any other trademarks or trade names mentioned are the property of their respective owners.

Broadcom Trade Press Contact Broadcom Investor Relations Contact Jeremy Hyatt T. Peter Andrew Senior Manager, Vice President, Corporate Communications Corporate Communications 949-926-5971 949-926-5663 jhyatt@broadcom.com andrewtp@broadcom.com

SOURCE Broadcom Corporation; BRCM Mobile & Wireless